What are the requirements of PCBA welding processing for PCB board?
2022-12-22
PCBA welding processing, there are usually a lot of requirements for PCBA board, and must meet the requirements of the board to accept welding processing. So why does welding process need to have so many requirements on the board? Originally, in the process of PCBA processing, there will be a lot of special technology, and the application of special technology will bring the requirements of PCB board. If there are problems with PCB board, it will increase the difficulty of PCBA welding process, which may eventually lead to welding defects, unqualified board and so on.
Therefore, in order to ensure the smooth completion of the special process processing, but also to facilitate PCBA welding processing, PCB board in the size, pad distance and other aspects to meet the manufactability requirements, then Shenzhen PCBA processing manufacturers - Shenzhen STG Electronics to introduce PCBA welding processing requirements for PCB board.
1. PCB size
PCB width (including board edge) should be greater than 50mm, less than 460mm, PCB length (including board edge) should be greater than 50mm. If the size is too small, it needs to be made into a Mosaic.
2. PCB edge width
Board edge width: 5mm, board spacing: 8mm, pad and board edge distance: 5mm
3, PCB bending degree
Upward bending degree: 1.2mm, downward bending degree: 0.5mm, PCB twist degree: maximum deformation height ÷ diagonal length: 0.25
4, PCB board Mark point
Mark's shape: standard circle, square, triangle;
The size of Mark; 0.8~1.5mm;
Mark's material: gold plating, tin plating, copper platinum;
Mark surface requirements: surface smooth, smooth, no oxidation, no dirt;
Mark's surrounding requirements: there should be no green oil or other obstacles within 1mm around, which is obviously different from Mark's color;
Mark position: more than 3mm away from the edge of the board, there can not be similar to Mark within 5mm of the hole, test points, etc.
5. PCB pad
There is no through hole in the patch component pad. If there is a through hole, the solder paste will flow into the hole, resulting in less tin in the device, or tin flow to the other side, resulting in uneven board surface, unable to print solder paste.
In PCB design and production, it is necessary to understand some knowledge of PCBA welding process, so as to make the product suitable for production. Understanding the requirements of the processing plant first can make the production and manufacturing process more smooth and avoid unnecessary trouble.
This is the requirements of PCBA welding processing for PCB board. In the production of PCB board, we should not slack off. Only by producing high-quality and compliant PCB board can the board better accept other special processes, give life to PCB board and inject the soul of function.
STG provides pcb circuit board processing, batch customization of PCB board, flexible MOQ, fast delivery,pcb circuit board processing can be a small batch, large quantity, to ensure stable performance.Welcome your online consultation to sample customization
Therefore, in order to ensure the smooth completion of the special process processing, but also to facilitate PCBA welding processing, PCB board in the size, pad distance and other aspects to meet the manufactability requirements, then Shenzhen PCBA processing manufacturers - Shenzhen STG Electronics to introduce PCBA welding processing requirements for PCB board.
1. PCB size
PCB width (including board edge) should be greater than 50mm, less than 460mm, PCB length (including board edge) should be greater than 50mm. If the size is too small, it needs to be made into a Mosaic.
2. PCB edge width
Board edge width: 5mm, board spacing: 8mm, pad and board edge distance: 5mm
3, PCB bending degree
Upward bending degree: 1.2mm, downward bending degree: 0.5mm, PCB twist degree: maximum deformation height ÷ diagonal length: 0.25
4, PCB board Mark point
Mark's shape: standard circle, square, triangle;
The size of Mark; 0.8~1.5mm;
Mark's material: gold plating, tin plating, copper platinum;
Mark surface requirements: surface smooth, smooth, no oxidation, no dirt;
Mark's surrounding requirements: there should be no green oil or other obstacles within 1mm around, which is obviously different from Mark's color;
Mark position: more than 3mm away from the edge of the board, there can not be similar to Mark within 5mm of the hole, test points, etc.
5. PCB pad
There is no through hole in the patch component pad. If there is a through hole, the solder paste will flow into the hole, resulting in less tin in the device, or tin flow to the other side, resulting in uneven board surface, unable to print solder paste.
In PCB design and production, it is necessary to understand some knowledge of PCBA welding process, so as to make the product suitable for production. Understanding the requirements of the processing plant first can make the production and manufacturing process more smooth and avoid unnecessary trouble.
This is the requirements of PCBA welding processing for PCB board. In the production of PCB board, we should not slack off. Only by producing high-quality and compliant PCB board can the board better accept other special processes, give life to PCB board and inject the soul of function.
STG provides pcb circuit board processing, batch customization of PCB board, flexible MOQ, fast delivery,pcb circuit board processing can be a small batch, large quantity, to ensure stable performance.Welcome your online consultation to sample customization
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