What's the HDI?
1 , HDI Introduction
PCB(Printed circuit board) is supported by conductor wiring insulation material formed by structural components . Zai made the final product , it will be installed on integrated circuits , transistors, diodes, passive components ( such as: resistors, capacitors , connectors , etc.) and various other electronic components. Connected by wire , electronic signal can form a link and proper function . Therefore, the printed circuit board is a link to provide a platform components to undertake contact parts of the base .
Multifunctional electronic products tend to complicate the background, the integrated circuit device contacts distance shrinks , the speed of signal transmission is relatively improved, there will come an increase in the number of wiring , wiring length between points Localized shortening , these would require the application of porous high-density circuit configurations and technologies to achieve their objectives. Jumper wiring and basically in terms of single and double panel has reached the difficulties, which will go multi-layered circuit boards , and because the signal lines have been increased , more power layer and ground layer is designed to be a means to These are led from the layer printed circuit board (Multilayer Printed Circuit Board) is more general .
For high-speed electrical signal requirements , circuit boards must be provided with the AC characteristics of impedance control , high-frequency transmission capability , reduce unnecessary radiation (EMI) and so on . Using Stripline, Microstrip structure , multi-layered design has become necessary . To reduce the signal transmission quality problems , will use low dielectric quality factor, low decay rate insulation materials , electronic Yuan Jian Pei He organization for the miniaturization and array installation of , the board is also constantly in response to Xuqiu Tigaomiduo . BGA (Ball Grid Array), CSP (Chip Scale Package), DCA (Direct Chip Attachment) and other group parts assembly methods, the better to promote the printed circuit board into an unprecedented state of high density .
Circuit boards for products such structure , the industry has had several different names to refer to this board . For example: Europe and the United States since the industry had produced program is the construction by sequential way , so this type of product known as the SBU (Sequence Build Up Process), usually translated as " Serial by layer method . " As for the Japanese industry , then produced products such pore structure than in the past a lot of holes to be small , making such products Yinci Chen technology Wei MVP (Micro Via Process), General Fan Yi as " micro system process " . It was also because the traditional multilayer is called MLB (Multilayer Board), so call this kind of circuit board for the BUM (Build Up Multilayer Board), usually translated as " multilayer by layer -style . "
American Association for the IPC board to avoid confusion in consideration of products made of such as HDI (High Density Intrerconnection Technology) of the common name, if translated directly into a high density of links on the technology . But it does not reflect the characteristics of the circuit board , so most of the circuit board industry will be of such products as HDI board or full Chinese name of "high -density interconnect technology. " However, because oral smooth issues , it was also the product directly to saying such as "high -density circuit board "or HDI board .
Second , HDI classification
HDI technology can be divided into several type of technology . HDI products, the main driving force comes from the mobile communication products , high-end computer products and packaging with the substrate . These types of products in the technical requirements are completely different , so the HDI technology is not one, but several species, the following breakdown:
HDI products with small
High-density substrate and the sub- function products with HDI
Published by the BR world's first of the most authoritative HDI ( high density interconnect board) manual has been published on Happy Holden spent the past decade is now time to prepare the first , is also the only one on the HDI And Microvia technical manual.
A total of 16 book chapters, contain PCB materials , design , manufacture, assembly and advanced packaging knowledge . It is also the world's most complete a description of information and any of the HDI projects in the OEM electronics design , manufacture, assembly must-read book.